Special Sessions

Monday, December 12

SS-1: (see details here)

Signal Integrity and Power Integrity Challenges for Internet Infrastructure Physical Layer (Mo-2)


Mike Resso and Heidi Barnes (Keysight Technologies)


Today’s internet infrastructure demands the highest level of signal integrity as well as power integrity within the physical layer. Backplanes, line cards, cables and subsystems must transmit error free data at serial rates of 56 Gigabits per second and higher over copper. This design challenge must be met with measurement and simulation tools that can provide correlation of data between time domain, frequency domain, and eye diagrams. This special session will include worldwide expertise in these engineering disciplines as well as academia to provide useful information for high speed digital designers.



Title / Authors / Affiliations



PAM-4 Channel Equalization Tips and Techniques

Heidi Barnes

Keysight Technologies, Santa Rosa, CA, USA



A New Method to Verify the Accuracy of De-Embedding Algorithms

Mike Resso1, Eric Bogatin2,3, Aayushi Vatsyayan3

1Keysight Technologies, Santa Rosa, CA, USA, 2Teledyne LeCroy, USA, 3University of Colorado, Boulder, USA



Frequency-Dependent Current Distribution of Edge-Coupled Interconnects: How it modifies the electrical characteristics of differential links

Diego M. Cortes-Hernandez

 Intel Guadalajara Design Center, Mexico



Extending the Usable Range of the 2-Port Shunt Thru Impedance Measurement

Steven M. Sandler

Picotest, Phoenix, AZ, USA

SS-2: (see details here)

High Speed and High Power Technologies for Modern Data Centers (Mo-6)


Jiangqi He and Jayashree Kar (Intel Corporation)


Modern datacenters require cutting edge technologies to meet their performance and complexity. Among many other challenges, such as software stack, business model, operational management and others, high speed signaling and high power technologies remain the key roles for building modern datacenters. Those challenges not only include new materials and innovative designs architectures, but also require new tools and methodologies. This special section will cover some of the research and development topics that are directly linked with high performance datacenter solutions associated with microwave and electromagnetic technology developments.



Title / Authors / Affiliations



Signal Integrity Challenges for Data Center

Howard Heck

Intel Corporation, Hillsboro, OR, USA



High Density Integrated Voltage Regulator Solution for Data Center

Qiang Li

Virginia Tech, Blacksburg, VA, USA



CAD Challenges for Multi-physics

An-Yu Kuo

Cadence, San Jose, CA, USA



System Level Optimization of Power Delivery Networks

Felipe Leal-Romo

Intel Guadalajara Design Center, Mexico and ITESO – The Jesuit University of Guadalajara, Mexico

Tuesday, December 13

SS-3: (see details here)

Microwave Research and Technology Activities in Spain (Part I) (Tu-2)


Vicente E. Boria-Esbert (Technical University of Valencia) and Miguel A. Gómez-Laso (Public University of Navarre)


This special session is aimed at highlighting the main research lines, as well as the most relevant scientific and technological achievements, in the areas of RF circuits, microwave components and antennas that are being developed in Spain. For this purpose, several descriptive and technical presentations about recent activities performed by several Spanish research groups (from different R&D institutions and Universities) will be shown, covering the areas of analysis and design of active and passive components including various technological realizations.



Title / Authors / Affiliations



Computer-Aided Design (CAD) of Filters and Multiplexers for Passive Inter-Modulation (PIM) Set-ups

P. Soto1, D. Smacchia2, C. Carceller1, V. E. Boria1,2, M. Guglielmi1

1Technical University of Valencia, Valencia, Spain, 2Val Space Consortium, Valencia, Spain



Microwave periodic structures and synthesized structures with smooth profiles and their applications

I. Arnedo, I. Arregui, F. Teberio, M. Chudzik, A. Lujambio, D. Benito, J. Percaz, A. Gomez-Torrent, T. Lopetegi, M. A. Laso

Public University of Navarre, Pamplona, Spain



Recent Advances in the Design of Compact Microwave Components Based on Reactively-Loaded Transmission Lines

J. Selga, P. Vélez, M. Orellana, J. Bonache, F. Martin

Universtitat Autònoma de Barcelona, Bellaterra, Spain



Analytical and highly efficient numerical modeling of electromagnetic periodic structures

F. Medina, F. Mesa, R. Rodriguez-Berral, R. R. Boix

University of Seville, Seville, Spain



The Radiofrequency, Electromagnetics, Microwaves and Antennas Research Group (GREMA)

D. Segovia Vargas, M. Salazar Palma, J. Herraiz Martinez, L. García Muñoz, L. García Castillo, A. Rivera, K. Abdalmalak, G. Santamaría, F. Albarracin Vargas, A. García Lampérez, S. Llorente Romano

Carlos III University, Leganés, Spain

SS-4: (see details here)

Preparing and Presenting Papers for MTT-S Journals and Conferences (Tu-5)




How to Write a Paper for IEEE Journals and Navigate the Review Process

George E. Ponchak

NASA Glenn Research Center, Cleveland, USA


The careers of many people depends on their success in writing and getting their papers published. More important, the scientific process requires that scientific findings be published so that other researchers may build on your ideas or refute your findings. If authors are not able to publish their papers, then their careers are hurt and scientific progress slows and stops. Therefore, it is critical that researchers and engineers understand the process of writing and getting published their papers in reputable and cited journals and scientific conferences. However, often, authors’ papers are rejected because they did not understand what reviewers, Associate Editors, and Editors are looking for in a paper, even if the technical results are good.

This presentation will cover the steps that an author should take to increase the acceptance rate of their papers in journals and conference. It will cover the reasons most papers are rejected and how an author should organize their paper to avoid those reasons. Lastly, it will present what steps you should take if your paper is rejected to get it published in the same journal or in a different journal.

Click here to download full description


You, Your Slides, and Your Posters: Allies or Foes?

John W. Bandler

McMaster University and Bandler Corporation


In the first few blinks of an eye after you stumble onto the stage, or make an opening stab at your slides or poster, most of your audience has likely made up its mind. The rest of your performance serves as confirmation of your audience’s bias and impressions. And besides you, your slides and posters have their own agenda that reflects you, your expertise, your authenticity, and much more. As a writer and director of plays as well as a professor and entrepreneur—with experience in operating exhibition booths—I elaborate on effective presentations: understanding and embracing your audience’s needs; gaining trust: the importance of clarity, citation and acknowledgement; those crucial first few seconds and your first few slides; your slides and you: an exercise in psychology and art; and how to identify and avoid potential traps and pitfalls.

Click here to download full description

Wednesday, December 14

SS-5: (IEEE SIGHT/HAC Session), (see details here)

Enabling Information and Communications Technologies (ICT) for Humanitarian Aid (We-2)


Tushar Sharma (iRadio Lab, University of Calgary) and José E. Rayas-Sánchez (ITESO – The Jesuit University of Guadalajara)


Technology is enabling people increasingly being at the heart of humanitarian aid. Although the number of natural disasters and human conflicts continues to rise worldwide, access to communication technologies is increasing significantly faster. To build resilience and improve survivability in humanitarian crisis, the ongoing technological revolution may provide our greatest hope and opportunity. The IEEE Microwave Theory and Techniques Society (MTTS) and Antennas and Propagation Society (APS) recognize the roles they have outside their professional lives. In particular, MTTS/APS Special Interest Group in Humanitarian Technology (SIGHT) focuses on motivating high school students, young engineers, and professionals to apply low-cost innovative RF technologies for disaster readiness and humanitarian needs. To align with the IEEE Humanitarian Activities Committee (HAC) vision, in this special session we introduce several humanitarian initiatives involving wireless RF technologies with impactful local changes. Given the social and economic configuration of Latin America, this region offers a great opportunity for SIGHT/HAC projects, particularly those involving RF and microwave technologies, with a very high potential for significant positive impact, including areas such as disaster management, health care, low-cost wireless solutions, internet of space, emergency ad-hoc networks, agriculture, food, energy, security, etc.



Title / Authors / Affiliations



Opening Remarks and Introduction to MTTS APS SIGHT

Eric Mokole

IEEE Antennas and Propagation Society



An Agile and Accurate Microwave System for Tracking Elderly People Occupancy at Home

G. Paolini, M. Del Prete, F. Berra, D. Masotti, A. Costanzo

University of Bologna, Bologna, Italy



ICT Solutions for Agricultural Challenges in the Caribbean of Nicaragua

Mario Alemán1 and Marvin R. Arias2

1IEEE Humanitarian Activities Committee (HAC), 2National University of Engineering, Managua, Nicaragua



Improving the interaction of Down syndrome students through the use of RFID technology

J. L. Jadán-Guerrero1, L. A. Guerrero2, T. Sharma3

1Universidad Tecnológica Indoamérica, Quito, Ecuador, 2Universidad de Costa Rica, San Pedro de Montesdeoca, Costa Rica, 3University of Calgary, Calgary, Canada



Launching a Successful Career by Starting with Amateur Radio

James C. Rautio

President & CEO of Sonnet Software



Wireless infrastructure for connecting the last billion

Ibrahim Khalil

NXP Semiconductors, Phoenix, AZ, USA

SS-6: (see details here)

RF Applications of 3D Additive Manufacturing: Materials, Processes and Opportunities (We-4)


Thomas M. Weller and Eduardo A. Rojas-Nastrucci (University of South Florida)


Digital additive manufacturing (AM) is being increasingly studied for its potential applications at microwave and mm-wave frequencies. Several different AM techniques are available and each offers its own advantages and challenges. The presentations in this session will cover issues that span the development of novel microwave materials that are compatible with AM; AM techniques that include fused deposition modeling, micro-dispensing, polymer-jetting and aerosol spraying; and how AM is being successfully applied to manufacture new and high performance microwave circuits and antennas. Our intent is to provide a working level of understanding for those new to AM while also covering finer details and challenges for those with experience in the area.



Title / Authors / Affiliations



Additive Manufacturing of Microwave Electronics based on Functional Nanocomposites Materials

Jing Wang

University of South Florida, USA



3D Printed Microwave and THz Devices using Polymer-Jetting Technique

Hao Xin

University of Arizona, USA



Microwave and Mm-Wave Applications of 3D Multi-Material Digital Printing for Antennas and Circuit Components

Thomas Weller

University of South Florida, USA



Metallic 3D Printed Ka-Band Pyramidal Horn using Binder Jetting

E. A. Rojas-Nastrucci, J. Nussbaum, T. M. Weller, N. B. Crane

 University of South Florida, Tampa, USA

SS-7: (see details here)

Microwave Research and Technology Activities in Spain (Part II) (We-5)


Vicente E. Boria-Esbert (Technical University of Valencia) and Miguel A. Gómez-Laso (Public University of Navarre)


This special session gives continuity to SS-3 by highlighting research lines developed in Spain on RF circuits, microwave components and antennas. By means of a panel discussion, it is expected that this second part will open a discussion forum, and become a meeting point, in order to promote future collaborations between Spanish microwave R&D groups and the related international community (with special focus in the Latin America region, where microwave technologies are being pushed both at industries and academic organizations in recent years). Information about the 2018 European Microwave Week (EuMW) event to be held next September 2018 in Madrid (Spain) and about the European Microwave Association (EuMA) -that promotes microwaves in Europe and coordinates the organization of EuMW events- will be also provided in order to promote the active participation of the Latin America microwave community, and reinforce their collaborative links with European partners.



Title / Authors / Affiliations



Characterization Techniques for Stability and Noise in Microwave Amplifiers under Large-Signal Excitations

J. Collantes, J. Portilla, A. Anakabe, N. Otegi

University of the Basque Country (UPV/EHU), Leioa, Spain



Advances in the simulation of autonomous microwave circuits

A. Suarez, S. Sancho, M. Ponton, F. Ramirez

University of Cantabria, Santander, Spain



New Antenna Topologies for 5G Communication Systems

J. Fernández González, A. Tamayo Dominguez, M. Sierra Pérez, B. Galocha Iragüen, R. Martínez Rodriguez-Osorio, M. Sierra Castañer

Universidad Politécnica de Madrid, Madrid, Spain



Panel Discussion about Future Microwave Activities and Collaborations with Spanish Speaking Countries

(moderated by Miguel A. Gómez-Laso1)

Almudena Suarez2, Francisco Medina3, Vicente E. Boria4, Roberto S. Murphy5, and José E. Rayas-Sánchez6

1Public University of Navarre, Spain, 2University of Cantabria, Santander, Spain, 3University of Seville, Spain, 4Technical University of Valencia, Valencia, Spain, 5INAOE, Puebla Mexico, 6ITESO – The Jesuit University of Guadalajara, Mexico